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Proceedings Paper

Packaging for a rotational accelerometer: Is a standard plastic SOIC an industrial solution?
Author(s): Valter Motta; Giovanni Frezza; Mariapia Riva; Kritivasan Sivakumar
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Paper Abstract

On the contrary of microelectronics where standard packages like e.g. DIP, QFP, BGA, SOIC dominate, microsensor packaging seems to be characterized by custom and application-specific packages. Moreover, in microsensor applications packaging is typically a relevant cost component of the whole system. In this scenario, the main question to solve for a high volume and no product specific company mission is the following: how to design versatile, reliable, low-cost packages for microsensor. In this article the assembly solutions for a low-cost mass production of a rotational accelerometer sensor are shown. From the packaging design point of view, the stress minimization has been the main guideline for any assembly process and material characterization choice. The process and material issues, including numerical simulations, optimization by design and experiment, are discussed in detail. Breakthrough in this project were the wafer to wafer bonding as well as the die singulation, the die to die interconnection and the thermomechanical stress minimization.

Paper Details

Date Published: 25 August 2000
PDF: 11 pages
Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); doi: 10.1117/12.396457
Show Author Affiliations
Valter Motta, STMicroelectronics (Italy)
Giovanni Frezza, STMicroelectronics (Italy)
Mariapia Riva, STMicroelectronics (Italy)
Kritivasan Sivakumar, STMicroelectronics (Singapore)

Published in SPIE Proceedings Vol. 4174:
Micromachining and Microfabrication Process Technology VI
Jean Michel Karam; John A. Yasaitis, Editor(s)

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