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Proceedings Paper

Toward determining cost, quality, and turn-around time of MEMS devices fabricated in a distributed prototyping environment
Author(s): William L. Benard; Kaigham J. Gabriel; Michael A. Huff
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Paper Abstract

The MEMS Exchange is a DARPA funded research program to provide the domestic MEMS community with an interface between MEMS designers and microfabrication facilities to allows designer to develop and exercise custom process sequences. These process sequences may cross the boundaries separating fabrication facilities in order to maximize process and design freedom. Information transfer within the MEMS-Exchange fabrication network takes place almost exclusively via the Internet, so process information and metrology data is available to customers near real time. In order for the designers to utilize such a facility, basic operational information about the execution of a process sequence, such as price, turn-around time and quality must be available. Time stamps, process metrology and cost data are all captured as part of routine MEMS Exchange operation. Special operations instrumentation has also been implemented in a software tool called the Process Event Logger to measure process requirements in terms of machine and staff time, and to determine the costs of delayed information, materials and equipment availability. The initial data is presented which is intended to be used to develop a model for MEMS prototyping fabrication to determine expected cost, turn-around time and quality for custom process sequences.

Paper Details

Date Published: 25 August 2000
PDF: 10 pages
Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); doi: 10.1117/12.396436
Show Author Affiliations
William L. Benard, Carnegie Mellon Univ. and MEMS Exchange (United States)
Kaigham J. Gabriel, Carnegie Mellon Univ. (United States)
Michael A. Huff, MEMS Exchange (United States)

Published in SPIE Proceedings Vol. 4174:
Micromachining and Microfabrication Process Technology VI
Jean Michel Karam; John A. Yasaitis, Editor(s)

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