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Proceedings Paper

Design and fabrication of a GXGA microdisplay chip
Author(s): Paul M. F. Colson; Freddy De Pestel; Marnix Tack; Gust Schols; Herbert De Smet; Jean Van den Steen; Andre Van Calster
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Paper Abstract

Microdisplay-based imaging system are quickly becoming very important. A light valve based on a GXGA microdisplay with 5 megapixels is targeted. The pixel pitch is 15 micrometers , leading to an active display area of 38.4 by 30.72 mm. Both the design and the fabrication of such a large die have presented several challenges. This paper describes the design of reticles for GXGA resolution with on-chip drivers. The chip size associated with this resolution e4xceeds the available reticle size. Stitching is used for the processing of large x-Si backplanes. The reticle set is also suitable for GXGA and XGAp resolutions with drivers. The front-end layers are implemented in a standard double metal 0.7micrometers CMOS technology extended with minimal adaptations. The back-end comprises advanced sub-halfmicron processing steps: two metallization layers with a 500nm-feature size for the light shielding function resp. mirroring function.

Paper Details

Date Published: 18 August 2000
PDF: 9 pages
Proc. SPIE 4181, Challenges in Process Integration and Device Technology, (18 August 2000); doi: 10.1117/12.395745
Show Author Affiliations
Paul M. F. Colson, Alcatel Microelectronics (Belgium)
Freddy De Pestel, Alcatel Microelectronics (Belgium)
Marnix Tack, Alcatel Microelectronics (Belgium)
Gust Schols, Alcatel Microelectronics (Belgium)
Herbert De Smet, IMEC (Belgium) and Univ. of Gent (Belgium)
Jean Van den Steen, IMEC (Belgium) and Univ. of Gent (Belgium)
Andre Van Calster, IMEC (Belgium) and Univ. of Gent (Belgium)

Published in SPIE Proceedings Vol. 4181:
Challenges in Process Integration and Device Technology
David Burnett; Shin'ichiro Kimura; Bhanwar Singh, Editor(s)

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