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Proceedings Paper

Polymer UV-molding for micro-optical systems and O/E-integration
Author(s): Peter Dannberg; Gunnar Mann; Lars Wagner; Andreas H. Braeuer
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Paper Abstract

The potential and limits of micromoulding technology for the wafer scale hybrid integration of micro-optic elements on top of arbitrary substrates like glass, Silicon, III/V-semiconductors by a process which is performed in a modified contact mask aligner. The elements are characterised by high precision and stability, temperature stable and precise pitch, index, homogeneity, uniformity across the wafer, and they fulfill additional requirements for a practical application (AR-coating, separation in a dicing saw). Additionally, the technology for a two- sided replication of elements has been developed. The precision of lens arrays fabricated by reflow and UV-moulding is investigated, and the high performance of these arrays in the collimation of fiber arrays is shown. Steps toward a wafer scale integration of lens arrays with vertical cavity surface emitting lasers (VCSELs) by locally selective replication are demonstrated.

Paper Details

Date Published: 18 August 2000
PDF: 9 pages
Proc. SPIE 4179, Micromachining Technology for Micro-Optics, (18 August 2000); doi: 10.1117/12.395684
Show Author Affiliations
Peter Dannberg, Fraunhofer-Institut fuer Angewandte Optik & Feinmechanik (Germany)
Gunnar Mann, Fraunhofer-Institut fuer Angewandte Optik & Feinmechanik (Germany)
Lars Wagner, Fraunhofer-Institut fuer Angewandte Optik & Feinmechanik (Germany)
Andreas H. Braeuer, Fraunhofer-Institut fuer Angewandte Optik & Feinmechanik (Germany)

Published in SPIE Proceedings Vol. 4179:
Micromachining Technology for Micro-Optics
Sing H. Lee; Eric G. Johnson, Editor(s)

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