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Proceedings Paper

Modular microcomponents for a flexible chemical process technology
Author(s): Norbert Schwesinger
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Paper Abstract

Different types of modular micro components such as pumps, values, reactors, separators, residence structures, extractors have been developed. Silicon was used as basic material. Most external dimensions of all different modules are equal. The components contain deep micro structures like channels or groves produced in dry or in wet chemical etching procedures. Different types of bonding technologies were applied to cover the flow structures. Openings positioned at the surface allow the connection with external standard tubes. These openings are arranged on each module at the same position. Due to this basic design a highly flexible combination of the micro modules is possible. Specific process conditions of chemical reactions can be adapted very easily and cost effective by means of module combinations. Holders for the modules contain the fluidic/electric connectors and allow their flexible combination. They are made of PEEK or PTFE. Fixing and sealing of external tubes to the modules can be realised by simple screwing procedures of standard tubes into the holders. Due to this simple screwing procedure all modules can be exchanged on demand. Operating pressures up to the limitation values of the external tubes can be applied to the modules. Electrical contacts arranged inside the holders allow the electrical connection of the modules to an external power supply, as well as a read out of electrical signals delivered from possibly integrated specific sensors. Stand alone examinations of single modules as well as specific chemical reactions in modular combinations were carried out to verify the performance of the micro devices. Successful and hopeful results were found in all cases.

Paper Details

Date Published: 18 August 2000
PDF: 7 pages
Proc. SPIE 4177, Microfluidic Devices and Systems III, (18 August 2000); doi: 10.1117/12.395673
Show Author Affiliations
Norbert Schwesinger, Ilmenau Technical Univ. (Germany)

Published in SPIE Proceedings Vol. 4177:
Microfluidic Devices and Systems III
Carlos H. Mastrangelo; Holger Becker, Editor(s)

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