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Proceedings Paper

New fabrication techniques for high dynamic range tunneling sensors
Author(s): David T. Chang; Fred P. Stratton; Randall L. Kubena; Deborah J. Vickers-Kirby; Richard J. Joyce; Thomas R. Schimert; Roland W. Gooch
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Paper Abstract

We have developed high dynamic range (105-106 g's) tunneling accelerometers1,2 that may be ideal for smart munitions applications by employing both surface and bulk micromachining processing techniques. The highly miniaturized surface-micromachined devices can be manufactured at very low cost and integrated on chip with the control electronics. Bulk-micromachined devices with Si as the cantilever material should have reduced long-term bias drift as well as better stability at higher temperatures. Fully integrated sensors may provide advantages in minimizing microphonics for high-g applications. Previously, we described initial test results using electrostatic forces generated by a self-test electrode located under a Au cantilever3. In this paper, we describe more recent testing of Ni and Au cantilever devices on a shaker table using a novel, low input voltage (5 V) servo controller on both printed wiring board and surface-mount control circuitry. In addition, we report our initial test results for devices packaged using a low-temperature wafer-level vacuum packaging technique for low-cost manufacturing.

Paper Details

Date Published: 15 August 2000
PDF: 6 pages
Proc. SPIE 4176, Micromachined Devices and Components VI, (15 August 2000); doi: 10.1117/12.395643
Show Author Affiliations
David T. Chang, Hughes Research Labs. (United States)
Fred P. Stratton, Hughes Research Labs. (United States)
Randall L. Kubena, Hughes Research Labs. (United States)
Deborah J. Vickers-Kirby, Hughes Research Labs. (United States)
Richard J. Joyce, Hughes Research Labs. (United States)
Thomas R. Schimert, Raytheon Systems Co. (United States)
Roland W. Gooch, Raytheon Systems Co. (United States)

Published in SPIE Proceedings Vol. 4176:
Micromachined Devices and Components VI
Eric Peeters; Oliver Paul, Editor(s)

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