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Proceedings Paper

Novel technique of thin photoresist micromachining for submillimeter wave circuits
Author(s): Wai Yip Liu; A. Harkar
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Paper Abstract

This paper demonstrates a novel technique of microfabrication for sub- millimeter waves circuits. The proposed technique enables E-plane high Q filters, low loss transitions and directional couplers to be formed for operating frequencies about W-band. The overall processing includes realization of ultra-thin E-plane components and rectangular waveguides with a think positive photoresist (known as SU8) onto a metal block that has been mechanically milled with standard flanges. The thickness of the E-plane substrate made with this methodology can be tailored down to a few microns. The measured insertion losses of an E-plane transmission line is typically below 0.1 dB per millimeter and the guide wavelength was found to be very close to the free-space wavelength. The methodology to achieve a thickness of dielectric substrate below ten microns also enables a transmission line of less than 30 ohm to realized with negligible losses. In addition, by glowing a conducting photoresist layer with precise thickness onto an oversize waveguide channel, it is possible to attain a re-scaled waveguide operating at submillimeter wave frequencies. In this paper, the this technique is first presented with particular reference given to the requirement of submillimeter wave applications. Our recent measurements is then given to substantiate the presentation.

Paper Details

Date Published: 15 August 2000
PDF: 8 pages
Proc. SPIE 4176, Micromachined Devices and Components VI, (15 August 2000); doi: 10.1117/12.395639
Show Author Affiliations
Wai Yip Liu, Univ. of Leeds (United States)
A. Harkar, Univ. of Leeds (United Kingdom)

Published in SPIE Proceedings Vol. 4176:
Micromachined Devices and Components VI
Eric Peeters; Oliver Paul, Editor(s)

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