
Proceedings Paper
Development of silicon ultrasonic transducer using micromachiningFormat | Member Price | Non-Member Price |
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Paper Abstract
Ultrasonic transducers are generally based on the piezoelectric effect and they are used in a variety of applications (medical imaging, NDE, ranging). Some of the main reasons for choosing an alternative technology, based on electrostatic effect, are low impedance mismatch with air and in water, low energy density, high efficiency, low costs, good integration with control electronics. Capacitive ultrasonic transducer consists in a parallel plates capacitor (like a condensor microphone) with a fixed electrode and a free one (membrane). A cMUT (capacitive Micromachined Ultrasonic Transducer) consists of an array of capacitive ultrasonic transducer with a metallized membranes suspended on silicon bulk. The membrane thickness is 0.4 micrometers . Tests of these transducers ( 2.5 MHz) fabricated in our laboratories are in progress.
Paper Details
Date Published: 15 August 2000
PDF: 9 pages
Proc. SPIE 4176, Micromachined Devices and Components VI, (15 August 2000); doi: 10.1117/12.395636
Published in SPIE Proceedings Vol. 4176:
Micromachined Devices and Components VI
Eric Peeters; Oliver Paul, Editor(s)
PDF: 9 pages
Proc. SPIE 4176, Micromachined Devices and Components VI, (15 August 2000); doi: 10.1117/12.395636
Show Author Affiliations
Giosue Caliano, Univ. degli Studi Roma Tre (Italy)
Fabio Galanello, Univ. degli Studi Roma Tre (Italy)
Vittorio Foglietti, Istituto di Elettronica dello Stato Solido (Italy)
Fabio Galanello, Univ. degli Studi Roma Tre (Italy)
Vittorio Foglietti, Istituto di Elettronica dello Stato Solido (Italy)
Elena Cianci, Istituto di Elettronica dello Stato Solido (Italy)
Alessandro Caronti, Univ. degli Studi Roma Tre (Italy)
Alessandro Caronti, Univ. degli Studi Roma Tre (Italy)
Published in SPIE Proceedings Vol. 4176:
Micromachined Devices and Components VI
Eric Peeters; Oliver Paul, Editor(s)
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