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Proceedings Paper

Characterization and design optimization for CMOS-compatible MEMS
Author(s): Tim K. Shia; Shih-I Yang; Cheng-Kuo Lee; Chih-Min Yao; Mark H. Lee
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Paper Abstract

A new study of characterizing the mechanical properties of the most used CMOS (Complementary Metal Oxide Semiconductor) materials and how to optimize design variables has revealed a convenient method that could be easily applied for many other micro-electro-mechanical device design and fabrication processes. In general thin film material properties are highly process dependent and are strictly connected to the final performance of some devices. While most micro-device designers do perform calculation to some extent before submitting their design to real fabrication process in order to have the accuracy and precision of the calculation is the input set of constituent material parameters. Mechanical properties of thin films are sometimes unavailable from regular CMOS fabrication foundries where many CMOS compatible micro- devices are fabricated in batches. This paper proposed a design and analysis flow to extract the needed material properties by making simple structures using pilot processes at desired foundry service. As the pilot process results come out, varied material properties can be verified by comparing the experimental data and simulation of data of specially designed test keys. Some test key designs have been widely reported [1,2]. As many of the existing test key designs are only concentrating on one layer or two of thin film materials in the test structures, the proposed method could work out for multi-layers of thin film materials at the same time, which comes even closer to the practical needs of CMOS compatible MEMS.

Paper Details

Date Published: 11 August 2000
PDF: 10 pages
Proc. SPIE 4175, Materials and Device Characterization in Micromachining III, (11 August 2000); doi: 10.1117/12.395605
Show Author Affiliations
Tim K. Shia, Metrodyne Microsystem Corp. (Taiwan)
Shih-I Yang, Metrodyne Microsystem Corp. (Taiwan)
Cheng-Kuo Lee, Metrodyne Microsystem Corp. (Taiwan)
Chih-Min Yao, National Ctr. of High Performance Computing (Taiwan)
Mark H. Lee, National Ctr. of High Performance Computing (Taiwan)

Published in SPIE Proceedings Vol. 4175:
Materials and Device Characterization in Micromachining III
Yuli Vladimirsky; Philip J. Coane, Editor(s)

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