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Proceedings Paper

Finite-element analysis of fiber shifts in fiber-solder-ferrule joints using AuSn solder
Author(s): Maw-Tyan Sheen; Paul-Cheng Chen; Jao-Hwa Kuang; Gol-Lin Wang; Wood-Hi Cheng; Hung-Lun Chang; Szu-Chun Wang; Chungyung Wang; Chih-Ming Wang
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Paper Abstract

The thermally induced fiber alignment shifts of fiber- solder-ferrule (FSF) joints in laser module packaging under temperature cycling tests have been studied numerically by a elastic-plastic finite-element method (FEM). The FSF joints were assembled using both the Pb(37)/Sn(63) and Au(80)/Sn(20) solders. Comparison between the calculated results shows that the Au/Sn solder in the FSF joint exhibits three times less fiber than Pb/Sn solder. This is due to the higher Young's modulus, yield strength, and melting temperature of AuSn hard solder than PbSn soft solder. This suggests that the hard solder of Au/Sn is more suitable for use in FSF assembly than soft solder Pb/Sn for laser module packaging to reduce thermally induced fiber alignment shift. Numerical calculations show that the major cause of fiber shift in FSF joints may come from the plastic solder yielding introduced by the thermal stress variation and the redistribution of the residual stresses during temperature cycling.

Paper Details

Date Published: 11 July 2000
PDF: 7 pages
Proc. SPIE 4078, Optoelectronic Materials and Devices II, (11 July 2000); doi: 10.1117/12.392200
Show Author Affiliations
Maw-Tyan Sheen, National Sun Yat-sen Univ. (Taiwan)
Paul-Cheng Chen, National Sun Yat-sen Univ. (Taiwan)
Jao-Hwa Kuang, National Sun Yat-sen Univ. (Taiwan)
Gol-Lin Wang, National Sun Yat-sen Univ. (Taiwan)
Wood-Hi Cheng, National Sun Yat-sen Univ. (Taiwan)
Hung-Lun Chang, Chunghwa Telecom Labs. (Taiwan)
Szu-Chun Wang, Chunghwa Telecom Labs. (Taiwan)
Chungyung Wang, Chunghwa Telecom Labs. (Taiwan)
Chih-Ming Wang, Chunghwa Telecom Labs. (Taiwan)


Published in SPIE Proceedings Vol. 4078:
Optoelectronic Materials and Devices II
Yan-Kuin Su; Pallab Bhattacharya, Editor(s)

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