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Proceedings Paper

Trade-offs in designing a mobile infrared scene projector
Author(s): Richard Brown; Henry M. Lastra; Francisca R. Vuong; Geoffrey W. Brooks
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Paper Abstract

Current test and evaluation methods are not adequate for fully assessing the operational performance of imaging infrared sensors while they are installed on the weapon system platform. The use of infrared (IR) scene projection in test and evaluation will augment and redefine test methodologies currently being used to test and evaluate forward looking infrared (FLIR) and imaging IR sensors. The Mobile Infrared Scene Projector (MIRSP) projects accurate, dynamic, and realistic IR imagery into the entrance aperture of the sensor, such that the sensor would perceive and respond to the imagery as it would to the real-world scenario. The MIRSP domain of application includes development, analysis, integration, exploitation, training, and test and evaluation of ground and aviation based imaging IR sensors/subsystems/systems. This applies to FLIR systems, imaging IR missile seekers/guidance sections, as well as non-imaging thermal sensors. The MIRSP Phase I, 'pathfinder' has evolved from other scene projector systems, such as the Flight Motion Simulator Infrared Scene Projector (FIRSP) and the Dynamic Infrared Scene Projector (DIRSP). Both of these projector systems were designed for laboratory test and evaluation use rather than field test and evaluation use. This paper will detail the MIRSP design to include trade-off analysis performed at the system/subsystem levels. The MIRSP Phase II will provide the capability to test and evaluate various electro-optical sensors on weapon platform. The MIRSP Phase I and II will be advancing current IR scene projector technologies by exploring other technologies such as mobility/transportability, packaging, sensors, and scene generation.

Paper Details

Date Published: 12 July 2000
PDF: 10 pages
Proc. SPIE 4027, Technologies for Synthetic Environments: Hardware-in-the-Loop Testing V, (12 July 2000); doi: 10.1117/12.391706
Show Author Affiliations
Richard Brown, U.S. Army Test and Evaluation Command (United States)
Henry M. Lastra, U.S. Army Simulation, Training, and Instrumentation Command (United States)
Francisca R. Vuong, U.S. Army Simulation, Training, and Instrumentation Command (United States)
Geoffrey W. Brooks, U.S. Army Test and Evaluation Command (United States)

Published in SPIE Proceedings Vol. 4027:
Technologies for Synthetic Environments: Hardware-in-the-Loop Testing V
Robert Lee Murrer Jr., Editor(s)

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