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Proceedings Paper

Resist technologies for ion projection lithography (IPL) stencil maskmaking
Author(s): Mathias Irmscher; Joerg Butschke; Klaus Elian; Bernd Hoefflinger; Karl Kragler; Florian Letzkus; Joerg Ochsenhirt; Christian Reuter; Reinhard Springer
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Paper Abstract

Corresponding to characteristics and manufacturing processes of IPL stencil masks, requirements of used resist technologies are determined. Two thin layer imaging (TLI) techniques, the single layer top surface imaging (TSI) and the bilayer CARL (chemical amplification of resist line) have been investigated and compared for stencil mask making. Especially the process design of CARL is discussed in detail. Additionally, a possible process integration of the carbon layer, that is deposited on the stencil mask and protects the membrane against damaging due to ion bombardment, is presented. Finally, results of silicon etching and complete manufactured stencil masks using the developed resist technologies are demonstrated.

Paper Details

Date Published: 21 July 2000
PDF: 11 pages
Proc. SPIE 3997, Emerging Lithographic Technologies IV, (21 July 2000);
Show Author Affiliations
Mathias Irmscher, Institut fuer Mikroelektronik Chips (Germany)
Joerg Butschke, Institut fuer Mikroelektronik Chips (Germany)
Klaus Elian, Infineon Technologies AG (Germany)
Bernd Hoefflinger, Institut fuer Mikroelektronik Chips (Germany)
Karl Kragler, Infineon Technologies AG (Germany)
Florian Letzkus, Institut fuer Mikroelektronik Chips (Germany)
Joerg Ochsenhirt, Institut fuer Mikroelektronik Chips (Germany)
Christian Reuter, Institut fuer Mikroelektronik Chips (Germany)
Reinhard Springer, Institut fuer Mikroelektronik Chips (Germany)

Published in SPIE Proceedings Vol. 3997:
Emerging Lithographic Technologies IV
Elizabeth A. Dobisz, Editor(s)

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