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Proceedings Paper

Characteristic study of chip-on-film interconnection
Author(s): Shyh-Ming Chang; JwoHuei Jou; Adam Hsieh; TaiHong Chen; ChingYun Chang; YungHao Wang; HongYu Lin; Chun Ming Huang
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Paper Abstract

Chip-on-film is a new technology after tape-automated- bonding (TAB) and chip-on glass (COG) in the interconnection of liquid crystal module. The thickness of the film, which is more flexible than TAB, can be as thin as 44 micrometers . It has pre-test capability, while COG hasn't. It possesses great potential in many product fabrication applications. In this study, we used anisotropic conductive film as the adhesive to bind the desired IC chip and polyimide film.

Paper Details

Date Published: 30 June 2000
PDF: 12 pages
Proc. SPIE 4079, Display Technologies III, (30 June 2000); doi: 10.1117/12.389412
Show Author Affiliations
Shyh-Ming Chang, Industrial Technology Research Institute and National Tsing-Hua Univ. (Taiwan)
JwoHuei Jou, National Tsing-Hua Univ. (Taiwan)
Adam Hsieh, Industrial Technology Research Institute (Taiwan)
TaiHong Chen, Industrial Technology Research Institute (Taiwan)
ChingYun Chang, Wintek Corp. (Taiwan)
YungHao Wang, Wintek Corp. (Taiwan)
HongYu Lin, Industrial Technology Research Institute (Taiwan)
Chun Ming Huang, Wintek Corp. (Taiwan)

Published in SPIE Proceedings Vol. 4079:
Display Technologies III
I-Wei Wu; Heiju Uchiike, Editor(s)

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