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Proceedings Paper

0.3-um pitch random interconnect patterning with node connection phase-shifting mask: experiments and simulations
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Paper Abstract

The effectiveness of node-connection phase-shifting mask (PSM) was investigated experimentally. In this method, the original design patterns are decomposed into several alternating PSM sub-patterns bas don geometrical rules, and multiple-exposure of these masks reconstructs the original design patterns. This is suitable for random logic interconnects, where wire features are on the 'DA-grid'. We applied this method to patterning a 0.3-micrometers pitch random interconnect with a conventional DUV exposure tool Random interconnect patterns with 0.3-micrometers pitch random interconnect with a conventional DUV exposure tool. Random interconnect patterns with 0.3-micrometers pitch were decomposed using in-house geometrical Boolean operators into three PSMs and were multiply exposed onto the same region of wafer using a KrF exposure tool. Though this is preliminary experiment without mask/process optimization, it shows a possibility of below 0.3-micrometers pitch logic interconnect with KrF tools. Thus, combining this with the phase-edge PSMs or some 'slimming' technologies for shrinking gate-length, the 0.1-micrometers generation logic LSIs are expected to be achieved with conventional DUV exposure tools.

Paper Details

Date Published: 5 July 2000
PDF: 11 pages
Proc. SPIE 4000, Optical Microlithography XIII, (5 July 2000); doi: 10.1117/12.389024
Show Author Affiliations
Hiroshi Fukuda, Hitachi, Ltd. (Japan)
Shoji Hotta, Hitachi, Ltd. (Japan)

Published in SPIE Proceedings Vol. 4000:
Optical Microlithography XIII
Christopher J. Progler, Editor(s)

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