
Proceedings Paper
Vibration of laminated composite plates embedded with shape memory alloy at elevated temperaturesFormat | Member Price | Non-Member Price |
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Paper Abstract
A finite element formulation and solution procedure for the free vibration behavior of composite plates with embedded shape memory alloy (SMA) at elevated temperatures is presented. The temperature-dependent material properties of MA and composite matrix, and the geometrical nonlinearity due to large thermal deflection are considered in the formulation. The solution procedure consists of two steps: large thermal deflection is determined first, then followed by the free vibration analysis about the thermally buckled equilibrium position. Examples of hybrid composite plates are given to show the variation of lowest few frequencies versus temperature and the influence of SMA on the natural frequencies at elevated temperatures. Potential applications to frequency turning and sonic fatigue using SMA are discussed.
Paper Details
Date Published: 12 June 2000
PDF: 11 pages
Proc. SPIE 3991, Smart Structures and Materials 2000: Industrial and Commercial Applications of Smart Structures Technologies, (12 June 2000); doi: 10.1117/12.388179
Published in SPIE Proceedings Vol. 3991:
Smart Structures and Materials 2000: Industrial and Commercial Applications of Smart Structures Technologies
Jack H. Jacobs, Editor(s)
PDF: 11 pages
Proc. SPIE 3991, Smart Structures and Materials 2000: Industrial and Commercial Applications of Smart Structures Technologies, (12 June 2000); doi: 10.1117/12.388179
Show Author Affiliations
Bin Duan, Old Dominion Univ. (United States)
Mohammad Tawfik, Old Dominion Univ. (United States)
Sylvain N. Goek, Ecole Superieure de Mecanique de Marseille (France)
Mohammad Tawfik, Old Dominion Univ. (United States)
Sylvain N. Goek, Ecole Superieure de Mecanique de Marseille (France)
Published in SPIE Proceedings Vol. 3991:
Smart Structures and Materials 2000: Industrial and Commercial Applications of Smart Structures Technologies
Jack H. Jacobs, Editor(s)
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