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Proceedings Paper

Compact packaged free-space optical interconnect
Author(s): W. Lee Hendrick; Philippe J. Marchand; Fang Xu; Sadik C. Esener
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Paper Abstract

We present a packaged free-space optical interconnect, based on the Optical Transpose Interconnect System, which is designed to provide a bi-directional interconnection between two optoelectronic chips each of which contains thirty-two modulators and detectors. The optical system consists of two polarization-selective computer generated holograms, which combine a 4 X 8 lenslet array for illumination of the modulators and a 2 X 2 lenslet array for interconnection, allowing for a very simple and compact optical system. In addition to the holograms, the only other components necessary to complete the optical system are a polarizing beam splitter, two quarter-wave retardation plates, and a spacer. All of the optics are aligned and packaged into a single unit that is remarkably compact: 12.7 X 32.2 mm, weighting only 8.3 g.

Paper Details

Date Published: 24 May 2000
PDF: 10 pages
Proc. SPIE 4089, Optics in Computing 2000, (24 May 2000); doi: 10.1117/12.386871
Show Author Affiliations
W. Lee Hendrick, Univ. of California/San Diego (United States)
Philippe J. Marchand, Optical Micro-Machines Inc. (United States)
Fang Xu, Univ. of California/San Diego (United States)
Sadik C. Esener, Univ. of California/San Diego (United States)

Published in SPIE Proceedings Vol. 4089:
Optics in Computing 2000
Roger A. Lessard; Tigran V. Galstian, Editor(s)

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