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Proceedings Paper

Packaging of an optoelectronic-VLSI chip supporting a 32 X 32 array of surface-active devices
Author(s): Michael H. Ayliffe; D. R. Rolston; E. L. Chuah; Eric Bernier; Feras S. J. Michael; D. Kabal; Andrew G. Kirk; David V. Plant
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Paper Abstract

Innovative approaches to the packaging of a high-performance module accommodating a 32 X 32 array of surface-active devices indium bump bonded to a 9 X 9 mm2 VLSI chip are described. The module integrates a mini-lens array, a copper heat spreader, a thermoelectric cooler and an aluminum heatsink. The mini-lens array is aligned and packaged with the chip using a novel six degrees of freedom alignment technique. The module is compact (44 X 44 X 45 mm3), easy to assemble and can be passively removed and inserted into a free-space optical system with no need for further adjustments. The chip is mounted directly on a flexible printed-circuit board using a chip-on-board approach, providing 207 bond pad connections to the chip. The junction-to-TEC thermal resistance is only 0.4 degree(s)C/W.

Paper Details

Date Published: 24 May 2000
PDF: 12 pages
Proc. SPIE 4089, Optics in Computing 2000, (24 May 2000); doi: 10.1117/12.386870
Show Author Affiliations
Michael H. Ayliffe, McGill Univ. (Canada)
D. R. Rolston, McGill Univ. (Canada)
E. L. Chuah, McGill Univ. (Canada)
Eric Bernier, McGill Univ. (Canada)
Feras S. J. Michael, McGill Univ. (Canada)
D. Kabal, Nortel Networks (Canada)
Andrew G. Kirk, McGill Univ. (Canada)
David V. Plant, McGill Univ. (Canada)


Published in SPIE Proceedings Vol. 4089:
Optics in Computing 2000
Roger A. Lessard; Tigran V. Galstian, Editor(s)

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