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Proceedings Paper

Feature integrity monitoring for process control using a CD SEM
Author(s): John A. Allgair; Gong Chen; Stephen J. Marples; David M. Goodstein; John D. Miller; Frank Santos
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Paper Abstract

Rapidly accelerating technology roadmaps have put increased pressure on in-line process control. CDs measured by automated SEMs are a common element of in-line process control. However, CD measurements alone may not be enough in all cases for adequate process control. For instance, degradation of feature integrity that does not lead to out of control CDs in photo can lead to scrap after etch. The cost of scrap and loss of time to results associated with catching photo process drift with after etch inspection has forced the development of new tools to monitor feature integrity in the ADI CD inspection module. Likewise, partially closed vias that are not caught with etch CD inspection can have a negative impact on copper processes. We describe a feature integrity monitoring technique using an automated CD-SEM that occurs simultaneously with the CD measurement to monitor and detect process drift prior to out of control CD events. We further describe the implementation of this technique in a production environment.

Paper Details

Date Published: 2 June 2000
PDF: 5 pages
Proc. SPIE 3998, Metrology, Inspection, and Process Control for Microlithography XIV, (2 June 2000); doi: 10.1117/12.386475
Show Author Affiliations
John A. Allgair, Motorola (United States)
Gong Chen, Motorola (United States)
Stephen J. Marples, Motorola (United States)
David M. Goodstein, KLA-Tencor Corp. (United States)
John D. Miller, KLA-Tencor Corp. (United States)
Frank Santos, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 3998:
Metrology, Inspection, and Process Control for Microlithography XIV
Neal T. Sullivan, Editor(s)

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