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Proceedings Paper

Design and analysis of across-chip linewidth variation for printed features at 130 nm and below
Author(s): J. Fung Chen; Robert John Socha; Kumar Puntambekar; Kurt E. Wampler; Roger F. Caldwell; Mircea V. Dusa; John C. Love; Greg Yeric; Brenda Stoner
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Paper Abstract

We discuss the incentive and design outlines for a reticle that is used for assessing across-chip linewidth variation (ACLV). For printing features whose dimensions are near half of the exposure wavelength ((lambda) ), the ACLV Solver reticle can be used to diagnose the contributing factors that cause the critical dimension (CD) to vary out of control. For example, mask error factor (MEF) and mask pattern density loading have both been shown to have a significant impact on ACLV. The focus of this paper is the ACLV design methodology, along with a couple of proposed designs of experiment (DOE). Conclusions and future work are discussed.

Paper Details

Date Published: 2 June 2000
PDF: 10 pages
Proc. SPIE 3998, Metrology, Inspection, and Process Control for Microlithography XIV, (2 June 2000); doi: 10.1117/12.386469
Show Author Affiliations
J. Fung Chen, ASML MaskTools, Inc. (United States)
Robert John Socha, ASML MaskTools, Inc. (United States)
Kumar Puntambekar, ASML MaskTools, Inc. (United States)
Kurt E. Wampler, ASML MaskTools, Inc. (United States)
Roger F. Caldwell, ASML MaskTools, Inc. (United States)
Mircea V. Dusa, ASML-TDC (United States)
John C. Love, TestChip Technologies, Inc. (United States)
Greg Yeric, TestChip Technologies, Inc. (United States)
Brenda Stoner, TestChip Technologies, Inc. (United States)

Published in SPIE Proceedings Vol. 3998:
Metrology, Inspection, and Process Control for Microlithography XIV
Neal T. Sullivan, Editor(s)

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