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Proceedings Paper

E-beam column monitoring for improved CD SEM stability and tool matching
Author(s): Timothy S. Hayes; Randall S. Henninger
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Paper Abstract

Tool matching is an important metric for in-line semiconductor metrology systems. The ability to obtain the same measurement results on two or more systems allows a semiconductor fabrication facility (fab) to deploy product in an efficient manner improving overall equipment efficiency (OEE). Many parameters on the critical dimension scanning electron microscopes (CDSEMs) can affect the long-term precision component to the tool-matching metric. One such class of parameters is related to the electron beam column stability. The alignment and condition of the gun and apertures, as well as astigmatism correction, have all been found to affect the overall measurements of the CDSEM. These effects are now becoming dominant factors in sub-3nm tool-matching criteria. This paper discusses the methodologies of column parameter monitoring and actions and controls for improving overall stability. Results have shown that column instabilities caused by contamination, gun fluctuations, component failures, detector efficiency, and external issues can be identified through parameter monitoring. The Applied Materials (AMAT) 7830 Series CDSEMs evaluated at IBM's Burlington, Vermont manufacturing facility have demonstrated 5 nm tool matching across 11 systems, which has resulted in non-dedicated product deployment and has significantly reduced cost of ownership.

Paper Details

Date Published: 2 June 2000
PDF: 8 pages
Proc. SPIE 3998, Metrology, Inspection, and Process Control for Microlithography XIV, (2 June 2000); doi: 10.1117/12.386463
Show Author Affiliations
Timothy S. Hayes, IBM Microelectronics Div. (United States)
Randall S. Henninger, Applied Materials (United States)

Published in SPIE Proceedings Vol. 3998:
Metrology, Inspection, and Process Control for Microlithography XIV
Neal T. Sullivan, Editor(s)

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