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Proceedings Paper

Micromechanical silicon precision scale
Author(s): Aarne S. Oja; Teuvo Sillanpaa; H. Seppae; Jyrki Kiihamaki; P. Seppala; Jani Karttunen; Kari Riski
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Paper Abstract

A micro machined capacitive silicon scale has been designed and fabricated. It is intended for weighing masses on the order of 1 g at the resolution of about 1 ppm and below. The device consists of a micro machined SOI chip which is anodically bonded to a glass chip. The flexible electrode is formed in the SOI device layer. The other electrode is metallized on the glass and is divided into three sections. The sections are used for detecting tilting of the top electrode due to a possible off-centering of the mass load. The measuring circuit implements electrostatic force feedback and keeps the top electrode at a constant horizontal position irrespective of its mass loading. First measurements have demonstrated the stability allowing measurement of 1 g masses at an accuracy of 2...3 ppm.

Paper Details

Date Published: 10 April 2000
PDF: 8 pages
Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); doi: 10.1117/12.382318
Show Author Affiliations
Aarne S. Oja, VTT Automation (Finland)
Teuvo Sillanpaa, VTT Automation (Finland)
H. Seppae, VTT Automation (Finland)
Jyrki Kiihamaki, VTT Electronics (Finland)
P. Seppala, VTT Electronics (Finland)
Jani Karttunen, VTT Electronics (Finland)
Kari Riski, Ctr. for Metrology and Accreditation (Finland)

Published in SPIE Proceedings Vol. 4019:
Design, Test, Integration, and Packaging of MEMS/MOEMS
Bernard Courtois; Selden B. Crary; Kaigham J. Gabriel; Jean Michel Karam; Karen W. Markus; Andrew A. O. Tay, Editor(s)

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