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Proceedings Paper

High-aspect-ratio electroformed Ni-Co microstructures with improved mold adhesion using a LIGA-like process and a Novolak sublayer
Author(s): Chantal G. Khan Malek; Lowell Thomas
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Paper Abstract

This work relates to a method for increasing the adhesion of polymer resist to electrically conductive substrates which is an important step in the lithographic steps for creating high-aspect-ratio micro structures. Here we are particularly interested in plating Ni-Co into the very tall high-aspect- ratio accurately patterned polymethyl methacrylate (PMMA) micromolds. They were made by deep x-ray lithography for primary or secondary metal structures or metal mold inserts within the framework of the LIGAS process. We investigated the effect of using a Novolak intermediate layer on various substrates to consolidate the adhesion of the relatively weak PMMA-metal interface. Modifying our process by introducing this intermediate Novolak sublayer improved the adhesive properties overall throughout the whole process including the planarization step, leading to a more reliable process with better yield as well an increase in the quality of the Ni-Co parts. The increase of bond resistance to heat and x-rays was evaluated by shear stress measurements.

Paper Details

Date Published: 10 April 2000
PDF: 8 pages
Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); doi: 10.1117/12.382315
Show Author Affiliations
Chantal G. Khan Malek, Louisiana State Univ. and LURE/CNRS (France)
Lowell Thomas, Dynamics Research Corp. (United States)

Published in SPIE Proceedings Vol. 4019:
Design, Test, Integration, and Packaging of MEMS/MOEMS
Bernard Courtois; Selden B. Crary; Kaigham J. Gabriel; Jean Michel Karam; Karen W. Markus; Andrew A. O. Tay, Editor(s)

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