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Proceedings Paper

Si-based microphone testing methodology and noise reduction
Author(s): C. S. Premachandran; Zhe Wang; Tai Chong Chai; S. C. Chong; Mahadevan K. Iyer
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Paper Abstract

In this paper two different packaging and testing approaches were studied for Si based microphone. Microphone performance was tested with Ceramic, Plastic and metal packages. Sensitivity testing of microphone is done when it is connected to an ASIC die. Testing was done with microphone and ASIC packaged separately and also in a single package. Substantial noise was generated when microphone and ASIC are tested separately in a PCB. Noise was detected after 150 Hz with the noise intensity reducing as it goes to higher frequencies. This was observed regardless of the packaging schemes. Different shielding methods were tried and found that copper foil shielding results in substantial noise reduction during frequency response testing and a flat response curve was observed with metal can package. Form this new testing methodology, it is demonstrated that same ASIC can be used repeatedly during microphone testing and hence some cost reduction can be expected.

Paper Details

Date Published: 10 April 2000
PDF: 5 pages
Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); doi: 10.1117/12.382304
Show Author Affiliations
C. S. Premachandran, Institute of Microelectronics (Singapore)
Zhe Wang, Institute of Microelectronics (Singapore)
Tai Chong Chai, Institute of Microelectronics (Singapore)
S. C. Chong, Institute of Microelectronics (Singapore)
Mahadevan K. Iyer, Institute of Microelectronics (Singapore)

Published in SPIE Proceedings Vol. 4019:
Design, Test, Integration, and Packaging of MEMS/MOEMS
Bernard Courtois; Selden B. Crary; Kaigham J. Gabriel; Jean Michel Karam; Karen W. Markus; Andrew A. O. Tay, Editor(s)

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