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Proceedings Paper

THERMODEL: a tool for thermal model generation and application for MEMS packages
Author(s): Vladimir Szekely; Marta Rencz; Andras Poppe; Bernard Courtois
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Paper Abstract

This paper present a tool and a method for the generation of reduce order thermal models, in order to assure modeling the effect of the package on the thermal behavior of the packaged device. The method is generic, and can be based either on the simulated or on the measured thermal transient response of the real packages. It is based on the generation of the time constant density spectrum of the thermal response function, from which we automatically generate a reduced order thermal model in the form of an RC ladder network model. Beyond presenting the generic methodology experimental results are also presented, based both on the simulation and measurement of MEMS elements and packages.

Paper Details

Date Published: 10 April 2000
PDF: 11 pages
Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); doi: 10.1117/12.382288
Show Author Affiliations
Vladimir Szekely, Technical Univ. of Budapest (Hungary)
Marta Rencz, MicReD Ltd. (Hungary)
Andras Poppe, MicReD Ltd. (Hungary)
Bernard Courtois, TIMA Lab. (France)

Published in SPIE Proceedings Vol. 4019:
Design, Test, Integration, and Packaging of MEMS/MOEMS
Bernard Courtois; Selden B. Crary; Kaigham J. Gabriel; Jean Michel Karam; Karen W. Markus; Andrew A. O. Tay, Editor(s)

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