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Proceedings Paper

Moving from analysis to design: a MEMS CAD tool evolution
Author(s): Karim Liateni; Hee Jung Lee; Mary Ann Perez-Maher; Jean Michel Karam
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Paper Abstract

The latest advances in MEMS technology have enabled the design of a new generation of electronic microsystems products. These systems may combine numerous analog/mixed signal microelectronics blocks and MEMS functions on a single chip or on two or more chips assembled within an integrated package. As designers have begun to use CAD tools to insert MEMS into these new products, additional requirements and constraints on the tools are emerging. As the MEMS designs move from prototypes to manufacturing production new CAD issues emerge.

Paper Details

Date Published: 10 April 2000
PDF: 5 pages
Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); doi: 10.1117/12.382287
Show Author Affiliations
Karim Liateni, MEMSCAP S.A. (France)
Hee Jung Lee, MEMSCAP S.A. (France)
Mary Ann Perez-Maher, MEMSCAP S.A. (United States)
Jean Michel Karam, MEMSCAP S.A. (France)


Published in SPIE Proceedings Vol. 4019:
Design, Test, Integration, and Packaging of MEMS/MOEMS
Bernard Courtois; Selden B. Crary; Kaigham J. Gabriel; Jean Michel Karam; Karen W. Markus; Andrew A. O. Tay, Editor(s)

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