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Proceedings Paper

Photovoltaic miniarrays assembled using multichip module technology (MCM)
Author(s): P. R. Ortega; L. Castaner
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Paper Abstract

The integration of small arrays of c-Si photovoltaic devices using a flip-chip Multichip Module technology is reported. A number of arrays made of 15 series-connected 2mm2 photovoltaic cells have been assembled, achieving a packaging density of 40 chips/cm2. Different cell geometries and several fabrication details have been investigated. Preliminary measurements of the dark characteristics are shown with good ideality factor values, thereby indicating that the interconnection of the devices did not jeopardize the properties of the individual cell. More than 6.5 V in open circuit conditions were typically measured, and simulations showed that for monochomatic illumination in the IR region above 60 mA/cm2 could be achieved for 100mW/cm2 of incoming light. Exposure to commercial IR lamp placed at 4cm distance from the miniarray generated approximately 1mW of power at 6.5V.

Paper Details

Date Published: 10 April 2000
PDF: 8 pages
Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); doi: 10.1117/12.382285
Show Author Affiliations
P. R. Ortega, Escuela Universitaria Politechnica de Vilanova i la Geltru (Spain)
L. Castaner, Univ. Politecnica de Cataluna (Spain)

Published in SPIE Proceedings Vol. 4019:
Design, Test, Integration, and Packaging of MEMS/MOEMS
Bernard Courtois; Selden B. Crary; Kaigham J. Gabriel; Jean Michel Karam; Karen W. Markus; Andrew A. O. Tay, Editor(s)

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