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Proceedings Paper

Optimization of the e-beam sensitive bilayer CARL process for stencil mask making
Author(s): Joerg Ochsenhirt; Joerg Butschke; Florian Letzkus; Bernd Hoefflinger; Mathias Irmscher; Christian Reuter; Reinhard Springer; Klaus Elian
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Paper Abstract

Hardmask-less stencil mask making requires masks with a high aspect ratio. The bilayer CARL (chemical amplification of resist lines) process was evaluated and optimized with respect of generating irregular resist features below 180 nm in a film thickness of 750 nm. Especially the dry development was detailed investigated using statistical design and analysis of experiment. Processed CARL resist masks are compared with Top Surface Imaging results. Finally, results of a deep silicon etching process using the CARL resist masks are presented.

Paper Details

Date Published: 3 February 2000
PDF: 10 pages
Proc. SPIE 3996, 16th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (3 February 2000); doi: 10.1117/12.377121
Show Author Affiliations
Joerg Ochsenhirt, Institut fuer Mikroelektronik Stuttgart (Germany)
Joerg Butschke, Institut fuer Mikroelektronik Stuttgart (Germany)
Florian Letzkus, Institut fuer Mikroelektronik Stuttgart (Germany)
Bernd Hoefflinger, Institut fuer Mikroelektronik Stuttgart (Germany)
Mathias Irmscher, Institut fuer Mikroelektronik Stuttgart (Germany)
Christian Reuter, Institut fuer Mikroelektronik Stuttgart (Germany)
Reinhard Springer, Institut fuer Mikroelektronik Stuttgart (Germany)
Klaus Elian, Infineon Technologies AG (Germany)

Published in SPIE Proceedings Vol. 3996:
16th European Conference on Mask Technology for Integrated Circuits and Microcomponents
Uwe F. W. Behringer, Editor(s)

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