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Proceedings Paper

Post-develop inspection for defect control by using the Lasertec 9MD83SRII system
Author(s): Andrew Wang; Wayne P. Shen; T. Nakashima; Kaku Ozawa
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Paper Abstract

In this study, Lasertec 9MD83SRII die-to-die inspection system was used for the post develop resist layer inspection. Residue resist defects were detected after develop. Defect locations were recorded. This result was compared with the inspection result after the final etching. Defect formation mechanism for different types of defects has been discussed in detail. Certain possible improvements have been made and results have been examined by the same technique. This study is a good understanding to resolve issues, such as defect problems of chrome dry etching.

Paper Details

Date Published: 30 December 1999
PDF: 4 pages
Proc. SPIE 3873, 19th Annual Symposium on Photomask Technology, (30 December 1999); doi: 10.1117/12.373365
Show Author Affiliations
Andrew Wang, Taiwan Mask Corp. (Taiwan)
Wayne P. Shen, Taiwan Mask Corp. (United States)
T. Nakashima, Lasertec, Inc. (United States)
Kaku Ozawa, Lasertec, Inc. (United States)

Published in SPIE Proceedings Vol. 3873:
19th Annual Symposium on Photomask Technology
Frank E. Abboud; Brian J. Grenon, Editor(s)

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