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Proceedings Paper

High-resolution ultraviolet defect inspection of DAP (darkfield alternate phase) reticles
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Paper Abstract

The manufacturing implementation of alternating aperture PSM's (AltPSM) has been gated by the impacts these techniques have on reticle manufacturing, specifically reticle defect inspection and repair. Die-to-die inspection techniques have been achieved for some clearfield multiphase alternate phase reticles, but the required die-to-database solutions are not currently available with defect inspection systems. In response to these mask manufacturing issues and IC design layout issues, resolution enhancing techniques based on Darkfield Alternate Phase (DAP) reticle designs are now of growing importance. A DAP Programmed Evaluation Reticle, DAPPER, was fabricated and inspected on a new high numerical aperture ultraviolet reticle inspection system. The results show reasonable defect sensitivity performance in the presence of both reticle geometry and quartz etch topography characteristic of 130-nm node advanced logic circuit DAP reticles.

Paper Details

Date Published: 30 December 1999
PDF: 14 pages
Proc. SPIE 3873, 19th Annual Symposium on Photomask Technology, (30 December 1999); doi: 10.1117/12.373310
Show Author Affiliations
Lars W. Liebmann, IBM Microelectronics Div. (United States)
Scott M. Mansfield, IBM Microelectronics Div. (United States)
Alfred K. K. Wong, IBM Microelectronics Div. (Hong Kong)
Jacek G. Smolinski, IBM Microelectronics Div. (United States)
Song Peng, IBM Corp. (United States)
Kurt R. Kimmel, IBM Microelectronics Div. (United States)
Maciej W. Rudzinski, KLA-Tencor Corp. (United States)
James N. Wiley, KLA-Tencor Corp. (United States)
Larry S. Zurbrick, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 3873:
19th Annual Symposium on Photomask Technology
Frank E. Abboud; Brian J. Grenon, Editor(s)

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