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Proceedings Paper

Tool and method for the theremal transient evaluation of packages
Author(s): Vladimir Szekely; Marta Rencz; Bernard Courtois
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Paper Abstract

This paper presents a new concept for the thermal transient measurement of IC packages. The TTMK thermal transient test kit described here consists of a test chip, a dedicated software running on a PC and a special cable connecting the PC to the IC package which encapsulates the test chip. The function of the thermal transient test equipment is realized partly by the test chip itself and partly by the measuring software. The software performs both the control of the measurements and the evaluation of the results. The output of the evaluation software may be a compact model network or the structure function describing the properties of the heat conduction path. The use of the TTMK kit and the capabilities of the evaluation software are presented in this paper.

Paper Details

Date Published: 8 October 1999
PDF: 10 pages
Proc. SPIE 3893, Design, Characterization, and Packaging for MEMS and Microelectronics, (8 October 1999); doi: 10.1117/12.368429
Show Author Affiliations
Vladimir Szekely, Technical Univ. of Budapest (Hungary)
Marta Rencz, MicReD Ltd. (Hungary)
Bernard Courtois, TIMA Lab. (France)

Published in SPIE Proceedings Vol. 3893:
Design, Characterization, and Packaging for MEMS and Microelectronics
Bernard Courtois; Serge N. Demidenko, Editor(s)

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