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Proceedings Paper

Algorithmic and practical questions of electrothermal circuit simulation
Author(s): Marta Rencz; Vladimir Szekely; A. Pahi; Andras Poppe
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Paper Abstract

In recent years great attention has been paid to the thermal issues in electronics design on system, board, package and chip level, including thermal and electro-thermal simulation of integrated circuits and MCM-s, or even integrated microsystems. In this paper we address some algorithmic issues regarding the method of simultaneous iteration. With the node reduction algorithm outlined here electro-thermal simulation of large problems becomes feasible. Besides this algorithmic innovation we provide a specification for a modular, platform independent electro-thermal simulator.

Paper Details

Date Published: 8 October 1999
PDF: 10 pages
Proc. SPIE 3893, Design, Characterization, and Packaging for MEMS and Microelectronics, (8 October 1999); doi: 10.1117/12.368423
Show Author Affiliations
Marta Rencz, Technical Univ. of Budapest (Hungary)
Vladimir Szekely, Technical Univ. of Budapest (Hungary)
A. Pahi, Technical Univ. of Budapest (Hungary)
Andras Poppe, Technical Univ. of Budapest (Hungary)

Published in SPIE Proceedings Vol. 3893:
Design, Characterization, and Packaging for MEMS and Microelectronics
Bernard Courtois; Serge N. Demidenko, Editor(s)

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