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Proceedings Paper

Testing microcomponents by speckle interferometry
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Paper Abstract

Design, manufacturing and test of microcomponents generate new challenges for measurement techniques in general. The non- contacting operation of optical metrology makes it attractive to solve the task of measuring geometric quantities of microparts. So far, speckle interferometry (ESPI) is well established as a measuring tool for analyzing deformation, vibration and strain on a macroscopic level. This paper deals with possibilities and application limits of ESPI in the case of scaling down the object size below one millimeter. In a first part, both spatial resolution and displacement sensitivity of the technique are discussed. Theoretical considerations are shown together with experimental verification. Secondly, a micro speckle interferometer will be presented that has been built for the use with different microscopes. Its capabilities are demonstrated by a practical application. The microcomponent under investigation is a bulk micromachined gyroscope, a demanding object with respect to its multilayer design. Developments aim at increasing the spatial resolution step by step and results obtained with different field of view will demonstrate the progress. Finally, the deformation behavior of an X-shaped torsional spring with a width of 100 micrometer could be characterized.

Paper Details

Date Published: 15 September 1999
PDF: 9 pages
Proc. SPIE 3825, Microsystems Metrology and Inspection, (15 September 1999); doi: 10.1117/12.364298
Show Author Affiliations
Petra Aswendt, Fraunhofer-Institut fuer Werkzeugmaschinen und Umformtechnik (Germany)
Roland Hoefling, Fraunhofer-Institut fuer Werkzeugmaschinen und Umformtechnik (Germany)
Karla Hiller, Chemnitz Univ. of Technology (Germany)

Published in SPIE Proceedings Vol. 3825:
Microsystems Metrology and Inspection
Christophe Gorecki, Editor(s)

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