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Proceedings Paper

Packaged and connectorized optical interconnect circuits for optoelectronic cross-connect switching
Author(s): Jan Popelek; Jun Ai; Yao Li
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Paper Abstract

Cross-connect switching is a common switching architecture for telecom and datacom applications. Large bandwidth O-E interface devices have recently been made commercially available. Small scale fast electronic switches and large scale optical interconnect circuits can be effectively used for handling large bandwidth O-E cross-connect switching. In this paper, we show two packaged and connectorized optical interconnect circuits. The first one is a 100 X 100 channel guided-wave circuit fully compatible, through MT array connectors, to O-E interface devices, such as Motorola OPTOBUSTM or Simens PAROLITM chips. The second one is a more scalable architecture which is a hybrid of free- space and fiber circuits. For demonstration purpose, a 256 X 256 channel hybrid circuit is shown. Key parameters, such as insertion loss, cross-talk, and bit-error-rate of these interconnect circuits are presented. Transmission and routing of video data are performed to demonstrate interconnect quality of various data links. Scalability of these demonstrated circuits to larger sizes are speculated.

Paper Details

Date Published: 1 October 1999
PDF: 7 pages
Proc. SPIE 3804, Algorithms, Devices, and Systems for Optical Information Processing III, (1 October 1999); doi: 10.1117/12.363974
Show Author Affiliations
Jan Popelek, NEC Research Institute (United States)
Jun Ai, NEC Research Institute (Canada)
Yao Li, NEC Research Institute (United States)

Published in SPIE Proceedings Vol. 3804:
Algorithms, Devices, and Systems for Optical Information Processing III
Bahram Javidi; Demetri Psaltis, Editor(s)

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