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Proceedings Paper

Metal-fill optical test structures for improved chemical mechanical polishing
Author(s): Shadi Alex AbuGhazaleh; Phillip Christie
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Paper Abstract

This paper presents an iterative algorithm that merges the physical layout of a circuit with an optical test structure called a wire segment hologram. Wire segment holograms are geometrical patterns that resemble circuit wiring but are arranged to project an holographic image when illuminated with a light source whose wavelength is comparable to the feature size of the process under test. The quality of the projected image is strongly correlated with the fidelity of the fabrication process and therefore provides rapid, non-contact, dimensional metrology. We propose that the merged circuit/test structure is ideal for metal processing which suffers from high pattern dependence, such as chemical mechanical polishing. By changing the relative width, height and pitch of the merged diffractive elements, it is possible to generate test structures with a wide range of metal density. Thus, these test structures can perform the dual task of reducing pattern dependent defect formation and characterizing the dimensional fidelity of the fabrication process. Initial results are presented that indicate the merged circuit/test structures can resolve mask offset variations as small as 0.1 micrometer for a 2 micrometer wire width.

Paper Details

Date Published: 27 August 1999
PDF: 10 pages
Proc. SPIE 3884, In-Line Methods and Monitors for Process and Yield Improvement, (27 August 1999); doi: 10.1117/12.361356
Show Author Affiliations
Shadi Alex AbuGhazaleh, Univ. of Delaware (United States)
Phillip Christie, Univ. of Delaware (United States)

Published in SPIE Proceedings Vol. 3884:
In-Line Methods and Monitors for Process and Yield Improvement
Sergio A. Ajuria; Jerome F. Jakubczak, Editor(s)

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