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Proceedings Paper

Finite element modeling of micromachined MEMS photon devices
Author(s): Boyd M. Evans III; D. W. Schonberger; Panos G. Datskos
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Paper Abstract

The technology of microelectronics that has evolved over the past half century is one of great power and sophistication and can now be extended to many applications (MEMS and MOEMS) other than electronics. An interesting application of MEMS quantum devices is the detection of electromagnetic radiation. The operation principle of MEMS quantum devices is based on the photoinduced stress in semiconductors, and the photon detection results from the measurement of the photoinduced bending. These devices can be described as micromechanical photon detectors. In this work, we have developed a technique for simulating electronic stresses using finite element analysis. We have used our technique to model the response of micromechanical photon devices to external stimuli and compared these results with experimental data. Material properties, geometry, and bimaterial design play an important role in the performance of micromechanical photon detectors. We have modeled these effects using finite element analysis and included the effects of bimaterial thickness coating, effective length of the device, width, and thickness.

Paper Details

Date Published: 2 September 1999
PDF: 8 pages
Proc. SPIE 3878, Miniaturized Systems with Micro-Optics and MEMS, (2 September 1999); doi: 10.1117/12.361268
Show Author Affiliations
Boyd M. Evans III, Oak Ridge National Lab. (United States)
D. W. Schonberger, Univ. of Kansas (United States)
Panos G. Datskos, Oak Ridge National Lab. and Univ. of Tennessee (United States)

Published in SPIE Proceedings Vol. 3878:
Miniaturized Systems with Micro-Optics and MEMS
M. Edward Motamedi; Rolf Goering, Editor(s)

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