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Proceedings Paper

Submicron patterning of aluminum films by laser ablation
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Paper Abstract

Microfabrication of sub-micron holes on 30 nm thick aluminum films on fused silica was investigated using pulse durations form 300 fs to 6 ns at 400 nm wavelength. Micromachined areas were investigate using atomic force microscopy for quality and size of features produced. Ablation diameters less than 400 nm was achieved with all pulse widths. Pulses less than 5 ps removed the films cleanly and left a flat- bottomed crater with no evidence of substrate melting over a wide fluence range.

Paper Details

Date Published: 30 August 1999
PDF: 6 pages
Proc. SPIE 3874, Micromachining and Microfabrication Process Technology V, (30 August 1999); doi: 10.1117/12.361248
Show Author Affiliations
David W. Doerr, Univ. of Nebraska/Lincoln (United States)
Dennis R. Alexander, Univ. of Nebraska/Lincoln (United States)


Published in SPIE Proceedings Vol. 3874:
Micromachining and Microfabrication Process Technology V
James H. Smith; Jean Michel Karam, Editor(s)

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