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Proceedings Paper

Economic fabrication of microscale features in thick resists using scanning projection lithography
Author(s): Marvin M. Kilgo III; Charles N. Williams; Dan Constantinide
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Paper Abstract

The commercialization of microfabricated devices requires an efficient, high yield manufacturing process. This paper demonstrates that the extension of scanning projection lithography into the manufacture of microscale devices presents an opportunity to develop cost effective processes. The use of thick dry film resists is a well characterized process. The technology associated with lamination and development is fully commercialized, and the process requirements for exposure allow great operational flexibility. Examples of the use of this technology to form microscale typical of MEMS devices are presented for a resists thickness of 30 micrometers . Microphotographs of the resulting features are presented, and the achievable resolutions and wall angles are quantified. An analysis of process economics for using thick film resists to generate MEMS feature at a commercially viable scale is presented. The factors influencing throughput are discussed, and the potential advantage of using a scanning projection tool with these resists is presented.

Paper Details

Date Published: 30 August 1999
PDF: 7 pages
Proc. SPIE 3874, Micromachining and Microfabrication Process Technology V, (30 August 1999);
Show Author Affiliations
Marvin M. Kilgo III, Tamarack Scientific Co. (United States)
Charles N. Williams, Tamarack Scientific Co. (United States)
Dan Constantinide, Tamarack Scientific Co. (United States)

Published in SPIE Proceedings Vol. 3874:
Micromachining and Microfabrication Process Technology V
James H. Smith; Jean Michel Karam, Editor(s)

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