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Proceedings Paper

Which etchant used and whether an etching mask exists: how they make differences on convex-corner undercutting configuration and compensation criteria
Author(s): Xinxin Li; Rongming Lin; Jianmin Miao; Minhang Bao
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Paper Abstract

Anisotropic etching of silicon creates different convex- corner undercutting contours in different varieties of etchant. This difference in undercutting configuration is investigated by analyses of the undercutting formation in detail. Based on Wulff-Jaccodine rules and some experimental results, theoretical analyses are given to clarify the reasons of different undercutting configuration caused by different etchant and the rationality of a certain plane occupying the undercutting position for a certain etchant. Furthermore, the investigation is lead to the convex-corner undercutting under maskless etching, i.e., during the etching mask on the structure removed. Experimental results show that the convex-corner undercutting under maskless etching is far different from that of conventional masked etching. The geometrical evolution of the undercutting is studied both experimentally and analytically. The compensation criteria for maskless etching are discovered and the corresponding compensation schemes are provided.

Paper Details

Date Published: 30 August 1999
PDF: 8 pages
Proc. SPIE 3874, Micromachining and Microfabrication Process Technology V, (30 August 1999); doi: 10.1117/12.361213
Show Author Affiliations
Xinxin Li, Nanyang Technological Univ. (Japan)
Rongming Lin, Nanyang Technological Univ. (Singapore)
Jianmin Miao, Nanyang Technological Univ. (Singapore)
Minhang Bao, Fudan Univ. (China)

Published in SPIE Proceedings Vol. 3874:
Micromachining and Microfabrication Process Technology V
James H. Smith; Jean Michel Karam, Editor(s)

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