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Proceedings Paper

Additive electroplating technology as a new integration concept for MEMS
Author(s): Josef Binder; Wolfgang Benecke
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Paper Abstract

This paper reports on a new integration concept for MEMS based on an Additive Electroplating Technology (AET). This technology allows the integration of fixed and movable electroplated microstructure on top of a standard ASIC by a low temperature back-end process. The basic fabrication sequence of the AET including aspects of a first level packaging will be presented. Various examples of novel MEMS for automotive and medical applications will show the capability and the limitations of this integration concept.

Paper Details

Date Published: 31 August 1999
PDF: 13 pages
Proc. SPIE 3876, Micromachined Devices and Components V, (31 August 1999); doi: 10.1117/12.360494
Show Author Affiliations
Josef Binder, Univ. of Bremen (Germany)
Wolfgang Benecke, Univ. of Bremen (Germany)

Published in SPIE Proceedings Vol. 3876:
Micromachined Devices and Components V
Patrick J. French; Eric Peeters, Editor(s)

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