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Proceedings Paper

Interferometric measurement for improved understanding of boundary effects in micromachined beams
Author(s): Brian D. Jensen; Fernando Bitsie; Maarten P. de Boer
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Paper Abstract

Micromachined beams are commonly used to measure material properties in MEMS. Such measurements are complicated by the fact that boundary effects at the ends of the beams have a significant effect on the properties being measured. In an effort to improve the accuracy and resolution of such measurements, we are conducting a study of support post compliances in cantilever and fixed-fixed beams. Three different support post designs have been analyzed by finite element modeling. The results are then compared to measurements made on actual devices using interferometry. Using this technique, the accuracy of measurements of Young's modulus has been improved. Continuing work will also improve the measurement of residual stress.

Paper Details

Date Published: 3 September 1999
PDF: 12 pages
Proc. SPIE 3875, Materials and Device Characterization in Micromachining II, (3 September 1999); doi: 10.1117/12.360480
Show Author Affiliations
Brian D. Jensen, Sandia National Labs. (United States)
Fernando Bitsie, Sandia National Labs. (United States)
Maarten P. de Boer, Sandia National Labs. (United States)

Published in SPIE Proceedings Vol. 3875:
Materials and Device Characterization in Micromachining II
Yuli Vladimirsky; Craig R. Friedrich, Editor(s)

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