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Proceedings Paper

Modifications of DLC films for MEMS applications
Author(s): Franklin Chau-Nan Hong; Yoou-Bin Guo; Jiun-Yao Wang
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Paper Abstract

SiOx-containing DLC films are deposited by plasma enhanced chemical vapor deposition on Si substrate. The effect of SiOx dopants on the stress, adhesion and hydrophobicity of the DLC films are studied. The incorporation of SiOx in the DLC films deposited by using hexamethyldisiloxane and CH4 mixture reduces the residual stress as well as enhances adhesion of the film on the substrate. Besides, the thermal stability of the film also improves.

Paper Details

Date Published: 3 September 1999
PDF: 9 pages
Proc. SPIE 3875, Materials and Device Characterization in Micromachining II, (3 September 1999); doi: 10.1117/12.360463
Show Author Affiliations
Franklin Chau-Nan Hong, National Cheng Kung Univ. (Taiwan)
Yoou-Bin Guo, National Cheng Kung Univ. (Taiwan)
Jiun-Yao Wang, National Cheng Kung Univ. (Taiwan)

Published in SPIE Proceedings Vol. 3875:
Materials and Device Characterization in Micromachining II
Yuli Vladimirsky; Craig R. Friedrich, Editor(s)

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