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Proceedings Paper

Analysis of manufacturing-scale MEMS reliability testing
Author(s): Katya M. Delak; Paul Bova; Allyson L. Hartzell; David J. Woodilla
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Paper Abstract

Long-term reliability of MEMS devices is increasingly important for large scale manufactured products. Traditional reliability testing used for microelectronic devices has been applied to integrated MEMS devices with the expectation that acceleration of MEMS-specific failure mechanisms would not be substantial. Rather, traditional package and circuit related failures would be accelerated. In addition, reliability tests that impart mechanical stresses on parts were expected to accelerate failures more so than traditional tests. It was found that while mechanical stresses were more effective in inducing MEMS related failures some traditional reliability tests did accelerate MEMS-related failures.

Paper Details

Date Published: 18 August 1999
PDF: 10 pages
Proc. SPIE 3880, MEMS Reliability for Critical and Space Applications, (18 August 1999); doi: 10.1117/12.359367
Show Author Affiliations
Katya M. Delak, Analog Devices, Inc. (United States)
Paul Bova, Analog Devices, Inc. (United States)
Allyson L. Hartzell, Analog Devices, Inc. (United States)
David J. Woodilla, Analog Devices, Inc. (United States)

Published in SPIE Proceedings Vol. 3880:
MEMS Reliability for Critical and Space Applications
Russell A. Lawton; William M. Miller; Gisela Lin; Rajeshuni Ramesham, Editor(s)

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