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Proceedings Paper

Selection of interferometric methods for silicon microelement testing
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Paper Abstract

In this paper we discuss the problems connected with analysis of mechanical properties of silicon microelements being basic parts of MEMS (e.g. micromembranes, microbeams). The quality of these microproducts (the reliability and the lifetime) is strongly dependent on the material properties and the mechanical design. There is also strong influence of the technology process on their performance. The best suited methods for their testing are optical full-field measuring methods. They provide data (displacements, strains, distribution of material constants) which may be easily used in the hybrid experimental-numerical methods for microelements analysis and optimization of their design.

Paper Details

Date Published: 17 August 1999
PDF: 12 pages
Proc. SPIE 3745, Interferometry '99: Applications, (17 August 1999); doi: 10.1117/12.357792
Show Author Affiliations
Witold Gorski, Warsaw Univ. of Technology (Poland)
Malgorzata Kujawinska, Warsaw Univ. of Technology (Poland)
Leszek A. Salbut, Warsaw Univ. of Technology (Poland)

Published in SPIE Proceedings Vol. 3745:
Interferometry '99: Applications
Werner P. O. Jueptner; Krzysztof Patorski, Editor(s)

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