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Proceedings Paper

High-resolution QWIP and MCT FPA modules at AIM
Author(s): Rainer Breiter; Wolfgang A. Cabanski; R. Koch; Werner Rode; Johann Ziegler; Kurt Eberhardt; Reinhard Oelmaier; Martin Walther
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Paper Abstract

The family of 2D detection modules at AEG Infrarot-Module GmbH (AIM) based on platinum silicide (PtSi) GaAs/AlGaAs quantum well (QWIP) devices or mercury cadmium telluride (MCT) focal planes for applications in either the 3.5 micrometers (MWIR) or 8.10 micrometers (LWIR) range was recently extended. Two new devices have been realized in the configurations 640 X 512 in a 24 micrometers pitch for mid and long wave applications using either a MCT photovoltaic (PV) array for the MWIR or a QWIP device for the LWIR, respectively. The existing 256 X 256 MCT MWIR was redesigned in a new configuration with increased fill factor of > 80 percent for improved NETD performance. The MCT units provide fast full frame rates up to > 100 Hz for the 640 X 512 units and 200Hz for the 256 X 256 units. The modules achieve with short snapshot integration times of typically 1ms excellent thermal resolution with an average NETD < 25 mK for the 640 X 512 NETD < 9mK for the 256 X 256 modules. The QWIP units are operated in either a rolling frame or snapshot integration mode with typical frame rates of 60Hz and reach a thermal resolution NETD < 25mK for full frame integration times. The FPAs are integrated up to modules using AIM's standard dewar cooler and command/control electronics (CCE) family. The package is basically identical to the existing large FA modules like the PtSi640 X 486 or the QWIP or MCT 256 X 256 in 40 micrometers pitch and is cooled by AIMs 1W split linear cooler. The CCE of the modules provides the common exclusively digital interface, using 14 Bit analog to digital conversion to provide state of the art correctability, access to highly dynamic scenes without any loss of information and simplified interchangeability of the units.

Paper Details

Date Published: 26 July 1999
PDF: 10 pages
Proc. SPIE 3698, Infrared Technology and Applications XXV, (26 July 1999); doi: 10.1117/12.354541
Show Author Affiliations
Rainer Breiter, AEG Infrarot-Module GmbH (Germany)
Wolfgang A. Cabanski, AEG Infrarot-Module GmbH (Germany)
R. Koch, AEG Infrarot-Module GmbH (Germany)
Werner Rode, AEG Infrarot-Module GmbH (Germany)
Johann Ziegler, AEG Infrarot-Module GmbH (Germany)
Kurt Eberhardt, TEMIC Semiconductors GmbH (Germany)
Reinhard Oelmaier, TEMIC Semiconductors GmbH (Germany)
Martin Walther, Fraunhofer-Institut fuer Angewandte Festkoerperphysik (Germany)

Published in SPIE Proceedings Vol. 3698:
Infrared Technology and Applications XXV
Bjorn F. Andresen; Marija Strojnik, Editor(s)

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