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Proceedings Paper

Remotely powered multichannel microprocessor-based telemetry systems for smart implantable devices and smart structures
Author(s): Christopher P. Townsend; Steven W. Arms; Michael J. Hamel
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Paper Abstract

The development of improved implantable devices and materials require knowledge of their in vivo behavior. However, little is known about the actual loads borne by implanted devices in vivo. Direct load measurement would provide extremely valuable information, for the improvement of device designs, and for the rapid rehabilitation of individuals in which devices have been implanted. Multichannel telemetry systems, combined with strain gauges, can provide this information.

Paper Details

Date Published: 20 July 1999
PDF: 7 pages
Proc. SPIE 3673, Smart Structures and Materials 1999: Smart Electronics and MEMS, (20 July 1999); doi: 10.1117/12.354260
Show Author Affiliations
Christopher P. Townsend, MicroStrain, Inc. (United States)
Steven W. Arms, MicroStrain, Inc. (United States)
Michael J. Hamel, MicroStrain, Inc. (United States)

Published in SPIE Proceedings Vol. 3673:
Smart Structures and Materials 1999: Smart Electronics and MEMS
Vijay K. Varadan, Editor(s)

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