Proceedings Paper
Cooling and positioning of DIRSP: a half-ton gorilla| Format | Member Price | Non-Member Price |
|---|---|---|
| $17.00 | $21.00 |
Paper Abstract
The Dynamic InfraRed Scene Projector (DIRSP) meets Army requirements for low-background hardware-in-the-loop testing of imaging infrared sensors. These requirements are met using cryogenic, vacuum technology to cool optical elements and emitter array sources. This paper discusses design and fabrication of two DIRSP subsystems, the Environmental Conditioning Subsystem, and the Mounting Platform Subsystem. These two subsystems enclose and support the Projection Optics Subsystem, and the Infrared Emitter Subsystem.
Paper Details
Date Published: 19 July 1999
PDF: 11 pages
Proc. SPIE 3697, Technologies for Synthetic Environments: Hardware-in-the-Loop Testing IV, (19 July 1999); doi: 10.1117/12.352890
Published in SPIE Proceedings Vol. 3697:
Technologies for Synthetic Environments: Hardware-in-the-Loop Testing IV
Robert Lee Murrer Jr., Editor(s)
PDF: 11 pages
Proc. SPIE 3697, Technologies for Synthetic Environments: Hardware-in-the-Loop Testing IV, (19 July 1999); doi: 10.1117/12.352890
Show Author Affiliations
Dave Higham, Mission Research Corp. (United States)
D. Gary Frodsham, Mission Research Corp. (United States)
D. Gary Frodsham, Mission Research Corp. (United States)
Paul Waugh, MSI Technologies (United States)
Fred Tomisino, MSI Technologies (United States)
Fred Tomisino, MSI Technologies (United States)
Published in SPIE Proceedings Vol. 3697:
Technologies for Synthetic Environments: Hardware-in-the-Loop Testing IV
Robert Lee Murrer Jr., Editor(s)
© SPIE. Terms of Use
