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Proceedings Paper

Microstructuring with 157-nm laser light
Author(s): Heinrich Endert; Michael Kauf; Eric E. Mayer; Michael J. Scaggs; John H. Fair; Dirk Basting
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Paper Abstract

The use of fluorine (F2) lasers, emitting at 157 nm, offers new possibilities for key applications demanding very high resolution and/or higher photon energy to expand the laser-processable material spectrum. Promising results have been achieved using F2 lasers at 157 nm for micromachining of various materials that are very difficult to process at other laser wavelengths. This paper reports about new F2 laser source developments and their efficiency in processing Teflon/Polytetrafluoroethylene and fused silica under moderate, uniform illumination conditions. Ablation rates and threshold parameters have been investigated. Scanning electron micrographs of the produced microstructures are presented.

Paper Details

Date Published: 15 July 1999
PDF: 5 pages
Proc. SPIE 3618, Laser Applications in Microelectronic and Optoelectronic Manufacturing IV, (15 July 1999); doi: 10.1117/12.352726
Show Author Affiliations
Heinrich Endert, Lambda Physik, Inc. (United States)
Michael Kauf, Lambda Physik, Inc. (United States)
Eric E. Mayer, Lambda Physik, Inc. (United States)
Michael J. Scaggs, Lambda Physik, Inc. (United States)
John H. Fair, Lambda Physik, Inc. (United States)
Dirk Basting, Lambda Physik, Inc. (United States)

Published in SPIE Proceedings Vol. 3618:
Laser Applications in Microelectronic and Optoelectronic Manufacturing IV
Jan J. Dubowski; Henry Helvajian; Ernst-Wolfgang Kreutz; Koji Sugioka, Editor(s)

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