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Proceedings Paper

Fused silica for 157-nm transmittance
Author(s): Charlene M. Smith; Lisa A. Moore
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Paper Abstract

The use of silica glass for the photomask material in 157-nm lithography tools is proposed. While fused silica enjoys widespread application for 248 and 193-nm optics, its use for 157-nm applications has been largely discounted, in part because of low transmittance at this wavelength. It is demonstrated here that silica glass can be made to have high transmittance at 157-nm. This is accomplished by minimizing the OH content of the glass. It is also noted that the thermal and mechanical properties of so-called dry silica are very close to higher OH silicas that are commonly used for lithography applications.

Paper Details

Date Published: 25 June 1999
PDF: 8 pages
Proc. SPIE 3676, Emerging Lithographic Technologies III, (25 June 1999); doi: 10.1117/12.351163
Show Author Affiliations
Charlene M. Smith, Corning Inc. (United States)
Lisa A. Moore, Corning Inc. (United States)


Published in SPIE Proceedings Vol. 3676:
Emerging Lithographic Technologies III
Yuli Vladimirsky, Editor(s)

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