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Proceedings Paper

Application of two-wavelength optical heterodyne alignment system in XS-1
Author(s): Soichiro Mitsui; Takao Taguchi; Yukiko Kikuchi; Hajime Aoyama; Yasuji Matsui; Masanori Suzuki; Tsuneyuki Haga; Makoto Fukuda; Hirofumi Morita; Akinori Shibayama
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Paper Abstract

This article presents the alignment performance of the two- wavelength optical heterodyne alignment system in the x-ray stepper XS-1. The alignment accuracy obtained by the double- exposure method with a single mask and a Si trench wafer was better than 20 nm. The dependence of the alignment accuracy on Si trench depth indicated that the two wavelengths compliment each other and ensure a 3(sigma) of less than 20 nm. The alignment capabilities for other processed test wafers were also investigated by mix-and-match exposure. For etched SiO2 and poly-Si film on a Si trench, an accuracy below 20 nm was obtained. For AlSiCu film sputtered on etched SiO2, there appeared systematic alignment offsets depended on die position, which are thought to be due to a wafer-induced shift. The systematic offset errors were eliminated by the use of send-ahead wafer and corrections for individual offsets on each die, and thus the alignment accuracy was improved to 20-40 nm for each alignment axis. The two-wavelength heterodyne alignment system of the XS-1 has sufficient potential for 130-nm lithography and below.

Paper Details

Date Published: 25 June 1999
PDF: 11 pages
Proc. SPIE 3676, Emerging Lithographic Technologies III, (25 June 1999); doi: 10.1117/12.351120
Show Author Affiliations
Soichiro Mitsui, Association of Super-Advanced Electronics Technologies (Japan)
Takao Taguchi, Association of Super-Advanced Electronics Technologies (Japan)
Yukiko Kikuchi, Association of Super-Advanced Electronics Technologies (Japan)
Hajime Aoyama, Association of Super-Advanced Electronics Technologies (Japan)
Yasuji Matsui, Association of Super-Advanced Electronics Technologies (Japan)
Masanori Suzuki, NTT Telecommunications Energy (Japan)
Tsuneyuki Haga, NTT Telecommunications Energy (Japan)
Makoto Fukuda, NTT Telecommunications Energy (Japan)
Hirofumi Morita, NTT Telecommunications Energy (Japan)
Akinori Shibayama, NTT Telecommunications Energy (Japan)

Published in SPIE Proceedings Vol. 3676:
Emerging Lithographic Technologies III
Yuli Vladimirsky, Editor(s)

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