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Proceedings Paper

Telepresence: a new paradigm for industrial and scientific collaboration
Author(s): Michael T. Postek Jr.; Marylyn Hoy Bennett; Nestor J. Zaluzec
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Paper Abstract

A portion of the mission of the NIST Manufacturing Engineering Laboratory is to improve and advance length metrology in aid of US industry. The successful development of a 'collaboratory' for telepresence microscopy technology. Telepresence microscopy is an advanced concept in the integration of computers and high-speed networks with scientific instruments for operation. Control, communication and research. NIST and TI, under the auspices of the National Automated Manufacturing Testbed and in collaboration with the University of Illinois and Argonne National Laboratory have developed a collaboratory testbed. The goal of this work is to demonstrate the value of TPM within organization having a large distributed manufacturing facility such as TI and between scientific research organizations such as NIST, ANL and UIC. Large distributed manufacturing sites need rapid response when problems threaten to disrupt multi-million dollar production facilities. This is particularly important when expertise needed to solve the problem or instrumentation is not locally present. The resulting delays are inevitable and often costly. Telepresence minimizes these delays. Once a sample has been received by a research facility, collaborators from multiple remotely located sites can rapidly access the collaboratory from their respective locations and collaborate in real-time to solve the problem using only their desktop computers and connections to the Internet. This presentation demonstrates the power afforded by this technology.

Paper Details

Date Published: 14 June 1999
PDF: 12 pages
Proc. SPIE 3677, Metrology, Inspection, and Process Control for Microlithography XIII, (14 June 1999); doi: 10.1117/12.350847
Show Author Affiliations
Michael T. Postek Jr., National Institute of Standards and Technology (United States)
Marylyn Hoy Bennett, Texas Instruments Inc. (United States)
Nestor J. Zaluzec, Argonne National Lab. and Univ. of Illinois/Chicago (United States)

Published in SPIE Proceedings Vol. 3677:
Metrology, Inspection, and Process Control for Microlithography XIII
Bhanwar Singh, Editor(s)

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